Wire bonders are used in the development, fabrication and packaging of microchips and other seminconductor devices. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages.

This seminar will include:

• an introduction to wire bonding,
• where wire bonding is used,
• wire bonding methods,
• current trends in wire bonding,
• an overview of wire bonding instruments

An extended Q&A session will follow the seminar allowing you to discuss wire bonding techniques that apply to your research.

Make sure you register, so we have enough morning tea for everyone.

Time:
10:30am – 11:30am — Seminar
11:30am – 12:00pm — Morning Tea

Date:
Friday, 9 November 2018

Location:
Level 1 Seminar Room, AIBN (Building #75), The University of Queensland (St Lucia)

Presenter

Tobias Hickmann – CEO, TPT Wire Bonders

Tobias has been with the company for 8 years. Tobias studied at the University of Applied Sciences, Munich, and held previous positions with Suss Mircotech (Mask Aligners) and Innolas (Laser Systems).

This seminar is brought to you by ANFF-Q, Nanovacuum and TPT: