Wire & Die Bonding Technical Seminar

Wire bonders are used in the development, fabrication and packaging of microchips and other seminconductor devices. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages.

This seminar will include:

  • an introduction to wire bonding,
  • where wire bonding is used,
  • wire bonding methods,
  • current trends in wire bonding,
  • an overview of wire bonding instruments

An extended Q&A session will follow the seminar allowing you to discuss wire bonding techniques that apply to your research.

Make sure you register, so we have enough morning tea for everyone.

10:30am – 11:30am — Seminar
11:30am – 12:00pm — Morning Tea

Friday, 9 November 2018

Level 1 Seminar Room, AIBN (Building #75), The University of Queensland (St Lucia)


Tobias Hickmann – CEO, TPT Wire Bonders

Tobias has been with the company for 8 years. Tobias studied at the University of Applied Sciences, Munich, and held previous positions with Suss Mircotech (Mask Aligners) and Innolas (Laser Systems).

This seminar is brought to you by ANFF-Q, Nanovacuum and TPT: