Computer-aided design (CAD)

computer-aided-design2ANFF-Q provides access to a suite of software packages that will assist you with the design and development of your project. Our Professional Officers can provide training and expert support in the use of these packages.

ANFF-Q provides access to SolidWorks, ACE 3D, COMSOL Multiphysics, CoventorWare, LinkCAD, IntelliSuite, and TannerEDA L-Edit and MEMS Pro. These software packages focus on 3D visualisation, MEMS, and semiconductor processing technologies and devices.

Additional software packages may be available through ANFF’s Design House. Specialised experts in the software packages will be available at different ANFF nodes around Australia. More information can be found on the ANFF website.


ANFF-Q also provides the computing power to support these software packages, with three dedicated CAD PCs available for use. These PCs typically have a 6-Core Intel Xeon CPU, 64GB ram, with dedicated CAD graphics cards. These systems are also installed with 3DS MAX after burner for high speed rendering purposes.


  • Dell Precision Workstation T7600
  • Dual Intel Xeon E5-2620 (6 Core HT, 2.5 GHz Turbo, 15 MB Cache)
  • 64 GB (8X8G) 1 600 MHz DDR3 ECC RDIMM
  • 2 x 2 TB 7 200 RPM SATA 3.0 Hard Disk Drive
  • NVIDIA 2GB Quadro Q4000


  • Dell Precision Workstation T7610
  • Dual Intel Xeon Processor E5-2637 v2 (Quad Core HT, 3.5 GHz Turbo, 15 MB Cache)
  • 64 GB (8 x 8GB) 1 866 MHz DDR3 ECC RDIMM
  • 256 GB 2.5inch SATA Solid State Drive
  • 2 TB 7 200 RPM SATA 3.0 Hard Disk Drive
  • DUAL 4 GB AMD FirePro W7000


  • Dell Precision Workstation 7810
  • Dual Intel Xeon Processor E5-2637 v3 (Quad Core HT, 3.5 GHz Turbo, 15 MB Cache)
  • 64 GB (8 x 8GB) 2 133 MHz DDR4 ECC RDIMM
  • 256 GB SATA Class 30 Solid State Drive
  • 2 TB 7 200 RPM SATA 3.0 Hard Disk Drive
  • Dual 8 GB AMD FirePro W7100


The University of Queensland


Room 261, Level 2E, AIBN (Bldg #75), St Lucia

Instrument contact:

Jane Li

CAD software

ACE 3000 3D

ACE 3000 3D or ACE 3D (for short) is a universal file format convertor. You can convert 2D to 3D in a Flash. No 3D Experience is Necessary. ACE 3D makes it easy to convert between 3D and EDA formats STEP, IGES, ACIS, STL, DXF, GDSII, Gerber, ODB++, and more; even postscript and PDF files.

ACE 3D easily converts any design in 4 Steps—no matter which CAD/EDA formats are chosen. ACE 3000 is perfectly suited for converting AutoCAD DXF and DWG files to manufacturing formats like: Gerber, Drill, GDS-II, and ODB++.

ACE includes the most comprehensive set of DXF import options available – giving you more Power & Flexibility. ACE allows you to selectively control how each layer is imported, choose which blocks to import, and so much more. In addition ACE has a friendly and modern GUI which drastically reduces the learning curve. Most users are able to successfully convert their first files in less than 5 minutes!

COMSOL Multiphysics

COMSOL Multiphysics is a platform for physics-based modeling and simulation. This general-purpose software platform, based on advanced numerical methods, will enable you to account for coupled or multiphysics phenomena.

You can expand the simulation platform with dedicated physics interfaces and tools for electrical, mechanical, fluid flow, and chemical applications. Additional interfacing products connect your COMSOL Multiphysics simulations with technical computing, CAD, and ECAD software. The ANFF-Q PCs are currently equipped with one semiconductor, one MEMs, and one microfluidic module of COMSOL licenses.


A range of platforms are available through Coventor, at ANFF-Q we have CoventorWare. The Coventorware software platform incorporates Conventor, virtual device fabrication, characterisation, multiphysics modelling and simulation software.

CoventorWare is an integrated suite of FEA based simulation software that has the accuracy, capacity, and speed to address real-world MEMS designs. The suite has many MEMS-specific features for modelling and simulating a wide range of MEMS devices, including inertial sensors (accelerometers and gyros), microphones, resonators, and actuators.

Coventorware is a leading design and simulation suite for all phases of MEMS and microfluidic design—from system level modelling to detailed 3D simulation and optimization, to manufacturing yield enhancement.

The Coventorware software suite is filled with MEMS and microfluidic-specific features that enable you to:

  • develop MEMS and microfluidic devices at a lower cost,
  • become productive more quickly, focusing on design instead of software,
  • efficiently design new products, moving them quickly from development into production,
  • rapidly explore and optimise design and process options,
  • adapt existing designs and processes to new markets,
  • efficiently accommodate design changes,
  • save fab cycles during development and improve yield.

Coventorware is comprised of four major modules that can be used individually to complement an existing design flow, or jointly to provide a complete design flow. These include architect, designer, analyzer and integrator.

The completeness of the tool suite and the high level of integration among the modules improves overall efficiency and ease of use, freeing users from the burden of manually transferring design data among multiple, stand-alone tools.


Covering all aspects of the MEMS design cycle, IntelliSuite provides a ground-breaking, end-to-end software solution for MEMS professionals. Some of the key package elements include:


A layout tool made specifically for the MEMS community, Blueprint supports GDS and DXF layout files and includes a built-in DRC tool. It also allows users to optimise their designs with the Quick3D feature and cross-section viewing capabilities.

Fastfield Multiphysics

A fully coupled multiphysics tool for electrostatic, mechanical and thermal analysis, Fastfield works directly with IntelliSuite’s MEMaterial database and the Hexpresso meshing engine. Users can also perform unattended, multiphysics-based parametric analyses.

Cleanroom Process Suite

This suite allows users to either quickly simulate and visualise complex, custom process flows with IntelliFab and FabSim, or select one of the many commercial PDK templates. IntelliEtch enables the rapid simulation of anisotropic etching of silicon or quarts on high-order planes, while the Cleanroom tools use physical solving methods, yielding much more accurate results than traditional voxel-based geometric approximation methods.


SYNPLE allows users to capture MEMS designs and systems at a schematic level and optimise by performing rapid behavioural analysis. Fast synthesis of mask layouts and 3D meshed models directly from schematics is also possible.

The IntelliSuite software architecture is based on a unique combination of bottom-up, process-driven design and top-down synthesis. Top-down methodology allows users to quickly explore a wide range of design options, while bottom-up design provides the accuracy to produce first-time right silicon. These methods are combined to get you to your designs faster and with fewer process iterations in the clean room.


LinkCAD is the most robust and powerful CAD translator available and supports a wide range of file formats. It features a very intuitive user interface, which guides you through each step of the conversion process.

But LinkCAD is much more than a converter, it can also:

  • Display the loaded drawings in the built-in CAD viewer, measure distances and highlight broken polylines.
  • Use several tools to merge overlapping polygons, join adjacent wires, auto-detect holes and perform many other operations.
  • Correct common design problems, such as open or self-intersecting polygons.
  • Convert several files without user intervention in batch mode.
  • Integrate LinkCAD in your workflow by running it from the command line and customizing the user interface.
  • Fix damaged files, which cannot be read by other software.


At ANFF-Q we have both SolidWorks 2014 and 2015. SolidWorks covers all aspects of the product development process with an intuitive, integrated 3D development environment that includes 3D design, simulation, electrical design, product data management and technical communication.

In addition, SolidWorks 2015 enables access to Dassault Systèmes’ 3DEXPERIENCE platform and its cloud-based capabilities. Designers and engineers can span multiple disciplines with ease, shortening the design cycle, increasing productivity and collaborating to deliver innovative products to market faster.

SolidWorks 3D CAD delivers robust 3D design capabilities, performance, and ease-of-use. Not only can you create fully detailed parts, assemblies, and production-level drawings, but you can access all the tools required to generate complex surfaces, sheet metal flat patterns, and structural welded assemblies. SolidWorks also includes wizards to automate designs, perform stress analysis, and determine the environmental impact of components.

SolidWorks Standard solutions include:

  • SolidWorks 3D CAD
  • Part and Assembly Modeling
  • 2D Drawings
  • Design Reuse and Automation
  • Animation and Visualization
  • Collaborate and Share CAD Data
  • Interference Check
  • First Pass Analysis Tools
  • Design for Manufacturing

Tanner EDA

A range of platforms are available through Tanner EDA, at ANFF-Q we have L-Edit™ and MEMS Pro™ installed.

These tools for analogue and mixed-signal ICs, ASICs and MEMS designs offer users a seamless and efficient path from design capture through to tape-out.

L-Edit is a complete hierarchical physical layout editor combining fast rendering and built-in productivity tools. L-Edit combines industry-leading rendering speed with powerful features to allow drawing and editing to be done quickly, while features such as object snapping, boolean operations, and alignment tools allow for an intuitive user experience.

The MEMS platforms are automated to speed up the design process, while enhanced Boolean operations eliminate manual steps and the ability to write macros in C allows customisable automation.

Tanner EDA offers the only tool on the market developed specifically for both MEMS and 3D-IC design and fabrication in one unified environment. It allows the integration of MEMS devices with analog/mixed-signal processing circuitry on the same IC, providing advanced functionality over standard mechanical design tools.