Direct Write Lithography for Nano & microstructures for research and industry applications
We are excited to introduce our new Maskless Aligner MLA150.
The maskless Aligner MLA150 serves as a trusted, indispensable workhorse in many multi-user facilities, nanofabrication labs, and national institutes. Application areas include MEMS, micro-optics, diffractive optical elements, sensors, electronic components, microfluidics, life sciences and much more.
The MLA150 is a maskless aligner and direct writer that utilizes non-contact exposure and outstanding ease of use. The direct writing technology integrates real-time auto focus achieving minimum structure size down to 1 μm and fast write speed up to 1351 mm2/min. The MLA150 is equipped with two lasers, 405 and 375 nm, for direct write of AZ and SU8 resists. An additional laser is integrated for interferometric stage position measurement, allowing high-precision multi-layer lithography (Fig. 1b).
The MLA150 is a flexible and powerful tool that combines high aspect ratio (Fig. 1c) and grayscale modes (Fig. 1d). The MLA allows you to “mix-and-match” optical with e-beam lithography (Fig 1a), opening endless lithography possibilities. The front and backside alignment capabilities ease the path towards integration and packaging.
Fig. 1(a) Nanoholes as precisely positioned traps for nanoparticles fabricated using “mix-and-match” lithography. 100-nm squared “nanoholes” patterned with e-beam lithography are separated by the coarse trenches created using the MLA150 precisely aligned to the existing nanohole pattern. Courtesy of EPFL LMIS1, Laussane. Fig. 1(b) An array of SQUIDs (superconducting quantum interference device) used for readout of metallic magnetic microcalorimeters (high-resolution particle detectors operated at low temperatures). These devices are micro-fabricated in large arrays and comprise up to 18 layers with submicron features. The MLA150 ensures the extreme overlay accuracy crucial for this application. Courtesy of the Kirchhoff Institute for Physics (KIP), Heidelberg University. Fig. 1(c) A gear wheel patterned in 800 μm thick SU-8 demonstrates the capability of MLA150 to create vertical sidewalls in thick resists. MEMS (Microelectromechanical systems) usually comprise a combination of microprocessor and functional components. MEMS may feature tunning forks, gear wheels, piezoelectric material, bio-, chemical or pressure sensors, or other miniaturized physical devices. Courtesy HIMT. Fig. 4(d) Moth-eye structure. Image courtesy of Shen Zhen Nahum-Eli Optical Technology Inc.