Pricing Policy
As part of Australia’s national research infrastructure, ANFF-Qld is committed to supporting leading-edge research and innovation by providing affordable access to advanced fabrication capabilities. Operating on a not-for-profit basis, we aim to maximise accessibility while maintaining high-quality service delivery.
Access charges are structured to reflect user categories:
- Australian public sector researchers are charged at marginal cost rates to promote academic and publicly funded research.
- Australian and international Industry users are charged at commercial rates, which support facility sustainability and reinvestment.
The new pricing model was introduced effective from 1 July 2025. It has been carefully developed in consultation with our governance and stakeholder groups. The model introduces Tier 1 and Tier 2 equipment classifications to establish a fairer and more transparent pricing structure based on equipment type, technical complexity, ongoing maintenance costs, and usage intensity.
New ANFF-Qld Pricing (Effective 1 July 2025)
User Group | Tier 1 Equipment | Tier 2 Equipment | Staff Support Rate |
Host University (The University of Queensland and Griffith University) | $40.00 ex gst | $30.00 ex gst | $75.00 ex gst |
Other Australian Universities | $40.00 ex gst | $30.00 ex gst | $75.00 ex gst |
Australian Publicly Funded Research Agency (i.e. CSIRO) | $40.00 ex gst | $30.00 ex gst | $75.00 ex gst |
Australian and International Industry | $85.00 ex gst | $75.00 ex gst | $150.00 ex gst |
- Project (Quoted Projects): An additional + 10% surcharge of project management and setup fee will be applied to the total quoted amount to be fully executed by ANFFQLD professional staff.
- Other items that may incur a fee include : Consumables, Legal Fees, and GST if applicable. ANFFQLD Consumables are charged at actual cost plus 10% through the ANFFQLD Booking System.
Type of Usage | Description |
Training – Equipment Operations and Process Development | Training is provided, covering both equipment usage and process development. |
Independent Equipment Operation | User is trained and operates the equipment independently without staff support. |
Staff-Supported Equipment Usage | User is trained but requires staff guidance and assistance for certain tasks. |
Project-Based Quoted Tasks | ANFF-Qld Staff fully manages and executes all operations and project activities on behalf of the customer. |
- ANFFQLD encourage all Host University users to complete equipment training so they may operate instruments independently, with staff-support assistance as needed.
- ANFFQLD Staff-performed Quote jobs will not be accepted for Host University users (UQ and Griffith). However, some special projects with specific exceptions may be considered and are subject to approval by the ANFFQLD Manager.
Below is the list of available equipment along with their respective tier classifications.
Resource | Resource Group | Location | Tier |
AJA RF/DC Sputterer | Deposition | UQ | Tier 1 |
ALD Picosun R-200 Advanced | Deposition | UQ | Tier 1 |
E-Beam Evaporator | Deposition | UQ | Tier 1 |
ACCRETECH SS20 Dicing Saw | Etching | UQ | Tier 1 |
ADT 7100 Dicing Saw | Etching | UQ | Tier 1 |
DRIE | Etching | UQ | Tier 1 |
HF VPE (dry etching) | Etching | UQ | Tier 1 |
KOH Tank | Etching | UQ | Tier 1 |
Oxford ICP RIE | Etching | UQ | Tier 1 |
Oxford RIE | Etching | UQ | Tier 1 |
Tepla Microwave Ashing system | Etching | UQ | Tier 1 |
XeF2 Etcher | Etching | UQ | Tier 1 |
SUSS Mask Aligner | Lithography | UQ | Tier 1 |
Maskless Aligner MLA150 | Lithography | UQ | Tier 1 |
MPO100 Nano 3D Printer | Lithography | UQ | Tier 1 |
Nanoscribe | Lithography | UQ | Tier 1 |
EVG Hot Embosser | Lithography | UQ | Tier 1 |
Sawatec spin coater | Lithography | UQ | Tier 1 |
Bruker Dimension XR AFM | Imaging and Surface Charachterisation | UQ | Tier 1 |
Cypher AFM | Imaging and Surface Charachterisation | UQ | Tier 1 |
Jeol IT-300 SEM | Imaging and Surface Charachterisation | UQ | Tier 1 |
JPK Biological AFM | Imaging and Surface Charachterisation | UQ | Tier 1 |
Leica SP8 confocal LSM | Imaging and Surface Charachterisation | UQ | Tier 1 |
NIKON Microscope | Imaging and Surface Charachterisation | UQ | Tier 1 |
Olympus OLS5100 Confocal Microscope | Imaging and Surface Charachterisation | UQ | Tier 1 |
RC2 Spectroscopic Ellipsometer | Imaging and Surface Charachterisation | UQ | Tier 1 |
Witec Raman AFM | Imaging and Surface Charachterisation | UQ | Tier 1 |
Zeiss 710 Confocal LSM | Imaging and Surface Charachterisation | UQ | Tier 1 |
COPE Evaporator 2 – Angstrom | Deposition | UQ | Tier 1 |
COPE_Chembox_Angstrom | Deposition | UQ | Tier 1 |
COPE_Evaporator 1 – Angstrom | Deposition | UQ | Tier 1 |
3C silicon carbide epitaxial furnace, SPT Micro EpiFlx | Deposition | GU | Tier 1 |
Furnace, Hitech LPCVD | Deposition | GU | Tier 1 |
ICPCVD – Oxford Instruments PlasmaPro 100 ICPCVD | Deposition | GU | Tier 1 |
Magnetron Sputterer SNS Gamma | Deposition | GU | Tier 1 |
e-Beam evaporator HHV ATS500 | Deposition | GU | Tier 1 |
ICP Plasma Etcher, STS Multiplex | Etching | GU | Tier 1 |
HF Vapour Etcher, SPTS uEtch | Etching | GU | Tier 1 |
Plasma Asher, Gasonics L3510 | Lithography | GU | Tier 1 |
Lithography Suite | Lithography | GU | Tier 1 |
Furnace, Hitech Oxidation | Materials synthesis and modification | GU | Tier 1 |
Ellipsometer, JA Woollam VUV-VASE Ellipsometer | Imaging and Surface Charachterisation | GU | Tier 1 |
AFM with 200mm mapping stage, Park Systems NX20 | Imaging and Surface Charachterisation | GU | Tier 1 |
Agilent B1500A Semi Device Analyzer | Device Testing | UQ | Tier 2 |
Agilent B1500A Semi Device Analyzer and Probe station | Device Testing | UQ | Tier 2 |
Agilent B1500A Semi Device Analyzer and Probe station | Device Testing | UQ | Tier 2 |
Encapsulation Glove Box | Device Testing | UQ | Tier 2 |
Four-point probe – COPE | Device Testing | UQ | Tier 2 |
Solar Cell QE/IPCE/I-V measure | Device Testing | UQ | Tier 2 |
Wire Bonder – HB16 | Device Testing | UQ | Tier 2 |
Laser Cutter – Trotec Speedy 360 | Etching | UQ | Tier 2 |
JEOL Desktop Sputterer | Imaging and Surface Charachterisation | UQ | Tier 2 |
KLA P7 – Stylus Profiler | Imaging and Surface Charachterisation | UQ | Tier 2 |
Olympus DSX1000 Digital Microscope | Imaging and Surface Charachterisation | UQ | Tier 2 |
SurPASS | Imaging and Surface Charachterisation | UQ | Tier 2 |
Zeiss Microscope – Long Pocket | Imaging and Surface Charachterisation | UQ | Tier 2 |
Zeta 300 Optical profiler/Film thickness system | Imaging and Surface Charachterisation | UQ | Tier 2 |
3D Printer – Ultimaker 2 | Lithography | UQ | Tier 2 |
COPE – UV / Ozone Cleaner | Lithography | UQ | Tier 2 |
Fumehood – corrosives | Lithography | UQ | Tier 2 |
Fumehood – flammables | Lithography | UQ | Tier 2 |
HMDS Oven | Lithography | UQ | Tier 2 |
Oxygen plasma cleaner – Long Pocket | Lithography | UQ | Tier 2 |
PC CAD1 Solidworks (L-Edit) | Lithography/Software | UQ | Tier 2 |
PC CAD2 L-Edit SW LinkCAD | Lithography/Software | UQ | Tier 2 |
PC CAD3 L-Edit VASE (Comsol- Simulaiton) | Lithography/Software | UQ | Tier 2 |
Planetary mixer | Lithography | UQ | Tier 2 |
Silanisation dessicator – Long Pocket | Lithography | UQ | Tier 2 |
Soft lithography station | Lithography | UQ | Tier 2 |
Spin Coater (PDMS) – Long Pocket | Lithography | UQ | Tier 2 |
Tergeo plasma cleaner | Lithography | UQ | Tier 2 |
UV Exposure-masking system (UV-KUB2) | Lithography | UQ | Tier 2 |
ATR-FTIR Spectrometer | Material Characterisation | UQ | Tier 2 |
GPC-DMF | Material Characterisation | UQ | Tier 2 |
GPC-THF | Material Characterisation | UQ | Tier 2 |
GPC Aqueous | Material Characterisation | UQ | Tier 2 |
LC-MS/MS | Material Characterisation | UQ | Tier 2 |
Litesizer | Material Characterisation | UQ | Tier 2 |
Mettler Toledo DSC | Material Characterisation | UQ | Tier 2 |
Mettler Toledo TGA | Material Characterisation | UQ | Tier 2 |
Plate Reader | Material Characterisation | UQ | Tier 2 |
Glovebox #1 | Synthesis | UQ | Tier 2 |
Glovebox #2 | Synthesis | UQ | Tier 2 |
Fume Cupboard | Etching | GU | Tier 2 |
Wetbench, Weslan | Etching | GU | Tier 2 |
Dicing Saw, Disco 2H/6T | Etching | GU | Tier 2 |
Rapid Thermal Processing/Annealing System (RTP) Accuthermo AW610 | Materials synthesis and modification | GU | Tier 2 |
Surface Profiler, DEKTAK 150 | Imaging and Surface Charachterisation | GU | Tier 2 |
Stress Measurement System, KLA-Tencor Flexus F2320 | Imaging and Surface Charachterisation | GU | Tier 2 |
Reflectometer, Filmetrics | Imaging and Surface Charachterisation | GU | Tier 2 |
Other costs that are not included in the hourly access rates are:
- Consumable costs (charged at cost +10%)
- Any legal fees incurred
- GST where applicable
For more details, download the ANFF access and pricing policy or contact us directly at anff@uq.edu.au.