Bridging ALD and PECVD for higher deposition rates and conformality

ANFF-Q is proud to present this technical seminar from Plasma-Therm’s Process Engineering Manager, Marco Notarianni.

Atomic Layer Deposition (ALD) has had significant impact both on mainstream and nanotechnology applications with the capability of depositing a wide range of materials at atomic scale, i.e. atomic layer by atomic layer. As might be expected, the successes of ALD have primarily focused on applications whose nanostructure sizes are commensurate with the thin films of ALD. However, there are applications where ALD’s capability are limiting such as where structures that need thicker films but with similar conformal properties are required. Obstacles to increased deployment of ALD are its well-known low rate of deposition and significant costs incurred from low utilization of precursors and reactants. This work describes an approach addressing the deposition rate issue by bridging ALD with a more conventional chemical vapor deposition (CVD)-like process. This process regime provides the benefits of ALD: quality conformal films, but at considerably higher deposition rates often associated with CVD and with lower costs due to the higher utilization of expensive precursors and reactants.

This technology, called “Fast Atomic Sequential Technology” (F.A.S.T.) will be described. With this FAST technology it is possible to achieve nearly the same conformal film objectives of ALD but at approximately 5 to 10 times the rate. In this presentation, an example of FAST using structures needing thicker films and high aspect ratio structures will be reviewed. Data showing highly conformal films of insulator (silicon dioxide), barrier (titanium nitride) and seed metal (copper) in structures typically seen in advanced packaging or microleds (aspect ratios of >10:1) will be shown.

Places are limited so make sure you register.

About the presenter

Marco Notarianni is currently the Process Engineering Manager at Plasma-Therm LLC.

He has been with Plasma-Therm LLC since 2014, first as a process engineer working on the process development for plasma dicing equipment especially for silicon based devices and then as a Product Manager for Singulator® product line before leading the Process Engineering group in his current role.

He received the Ph.D. degree in Nanotechnology and Molecular Science from the Queensland University of Technology in 2015 (QUT). During his Ph.D, he worked on carbon nanomaterials for energy generation and storage devices in collaboration with Rice University and University of South Florida. He also holds a M.S. in Nanotechnology Engineering and a B.S. in Electrical Engineering from University of Rome, La Sapienza. He published over 20 peer reviewed journal articles, 1 book chapter, 2 US provisional patents and he contributed to several invited talks and conferences in North America, Asia and Europe.